Draper is building the future of microelectronics at the Draper Advanced Packaging Facility. Customers turn to us to design, build and produce microelectronic components, including three-dimensional heterogeneously integrated (3DHi) microsystems, which enable the stacking of separately manufactured components into a single package that delivers advanced security, high precision, high accuracy and peak performance in harsh environments.
Based in St. Petersburg, Fla., the Advanced Packaging Facility is a Defense Microelectronics Activity (DMEA)-certified, trusted foundry manufacturing center that offers open-access production in an environment where customers can address the design, packaging, assembly and testing of 3DHi prototypes and products.
