Market Area:
Biotechnology Systems
Date:
-
Author:
Ava E. Giorgianni, Giselle Ventura, Joseph Hollmann, Corin Williams
Assembly of Large Flip Chip Die in Ceramic Packages
Market Area:
Other
Date:
-
Author:
J. Ramirez Ramos, K. Graham, T. Marinis, D. Hanson
Nonvolatile Tuning of Bragg Structures UsingTransparent Phase-Change Materials
Market Area:
Other
Date:
-
Author:
NICHOLAS A. NOBILE, CHUANYU LIAN, HONGYI SUN, YI-SIOU HUANG, BRIAN MILLS, COSMIN CONSTANTIN POPESCU, DENNIS CALLAHAN, JUEJUN HU, CARLOS A. RÍOS OCAMPO, AND NATHAN YOUNGBLOOD